We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for CT system.
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CT system Product List and Ranking from 11 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

CT system Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. ユー・エイチ・システム Kanagawa//Testing, Analysis and Measurement
  2. Comet Technologies Japan K.K. Comet Yxlon Kanagawa//Testing, Analysis and Measurement
  3. システムクリエイト Osaka//Industrial Machinery
  4. 4 テスコ Kanagawa//Testing, Analysis and Measurement
  5. 5 日本ベーカーヒューズ株式会社＆ベーカーヒューズ・エナジージャパン株式会社　 （旧）GEセンシング＆インスペクション・テクノロジーズ株式会社　＆　GEエナジー・ジャパン株式会社 Tokyo//Testing, Analysis and Measurement
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CT system Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. High-power, high-resolution X-ray CT system 'FF85 CT' Comet Technologies Japan K.K. Comet Yxlon
  2. [New Product] High-Power X-ray CT System 'YXLON UX50' Comet Technologies Japan K.K. Comet Yxlon
  3. X-ray CT system "inspeXio SMX-225CT" システムクリエイト
  4. 【UHS_X-ray CT System Imaging Example】 CT Cross-section of Solder Crack ユー・エイチ・システム
  5. 5 【UHS_X-ray CT System Imaging Case】FET Observation Case ユー・エイチ・システム

CT system Product List

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CT system "Phoenix VItomeIx S240"

CT system "Phoenix VItomeIx S240"

Improved functionality and design for industrial 2D radiography! Scan faster and see more.

The "Phoenix VItomeIx S240" is a CT system that combines high-efficiency Dynamic41 detector technology with high flux/target capabilities. To enhance flexibility, it is possible to install optional high-power nanofocus X-ray tubes of 180kV/20W and microfocus X-ray tubes of 240kV/320W. This unique combination allows for a wide range of applications, from high-quality scans of low-absorbent materials to 3D analysis of high-absorbent materials with a diameter of up to 500mm. 【Features】 ■ Achieves high image quality while enabling fast scans ■ Allows for efficient and easy increase of detection probability (POD) ■ Supports various 3D industrial or scientific microCT applications ■ Provides settings and optional tools to accurately meet production throughput targets *For more details, please refer to the PDF document or feel free to contact us.

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  • Image Processing Equipment
  • X-ray inspection equipment
  • Other inspection equipment and devices

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Microfocus X-ray fluoroscopy and CT system 'CheetahEVO'

Microfocus X-ray fluoroscopy and CT system 'CheetahEVO'

Equipped with a multi-focus X-ray tube! Effective for various applications such as resin parts, rubber parts, and metal parts.

The "Cheetah EVO" is a micro-focus X-ray fluoroscopy and CT system with dimensions W1,650 × D1,400 × H2,050 mm. It is equipped with a multi-focus X-ray tube that combines nano-focus mode and high-output mode. In addition to its outstanding expressive power provided by a 16-bit (65,000 gradation) flat panel detector, it is effective for various applications, including not only electronic components but also resin parts, rubber parts, and metal parts. 【Features】 ■ Equipped with a multi-focus X-ray tube that combines nano-focus mode and high-output mode ■ Outstanding expressive power with a 16-bit (65,000 gradation) flat panel detector ■ Effective for various applications Company Name: YXLON *For more details, please refer to the PDF materials or feel free to contact us.

  • X-ray inspection equipment
  • Other inspection equipment and devices

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X線マイクロCTシステム『TESCAN UniTOM XL』

X線マイクロCTシステム『TESCAN UniTOM XL』

幅広い試料やアプリケーションに柔軟に対応！高速・マルチスケールシステム

『TESCAN UniTOM XL』は、複数の解像度でイメージング可能な X線マイクロCTシステムです。 高スループットイメージングや多様なサンプルタイプにも適用。 エネルギー変換・貯蔵や製薬、民生品とその包装など様々な分野の 材料研究・故障解析・品質保証に用いることができます。 【特長】 ■高スループット ■高い柔軟性を有するイメージング機能 ■その場観察/ダイナミックCT ■さまざまなサンプルに対応 ■モジュール式設計 ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。

  • X-ray inspection equipment
  • Defect Inspection Equipment
  • Other inspection equipment and devices

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Nano Microfocus X-ray CT System diondo

Nano Microfocus X-ray CT System diondo

Nano microfocus with dual source capability / High resolution, high output X-ray CT system diondo d2

■Two X-ray sources can be mounted inside the nano-micro focus X-ray tube It is possible to mount two X-ray sources: a 240kV high-resolution transmission nano-focus X-ray tube and a 300kV high-power reflection micro-focus X-ray tube. The ability to choose between two types of X-ray tubes allows for a wide range of sample scanning, from high-resolution imaging of organic materials to imaging of high-density metallic objects that require high power. ■Large 417 mm, 139 μm pixel pitch high-resolution flat panel detector With a resolution of 3K and a size of 417 x 417 mm, the large flat panel detector with a pixel pitch of 139 μm delivers class-leading performance. ■High-precision granite manipulator Equipped with a compact design, the high-precision granite manipulator allows for convenient imaging of various subjects with the best resolution and high accuracy at all times.

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  • X-ray inspection equipment

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3D X-ray CT system "3DCT Series"

3D X-ray CT system "3DCT Series"

Capable of handling a wide range of work from high power to low power!

The "3DCT Series" is a three-dimensional X-ray CT system that utilizes our unique technology, the U-Centric (focus-centered rotation) function, allowing for 360-degree perspective observation and high-magnification CT imaging of a focused point with "microscopic vision" and even "nanoscale vision." It includes a lineup of models such as the ultra-high-resolution model "XVA-160αII," which achieves ultra-high magnification (2,000 times) and nanoscale focus sizes (250/800nm), the standard model "XVA-160R," and the wide-range model "Si-230/300." These systems are widely used for the high-precision non-destructive analysis of compact, high-density, and multilayered high-function electronic components. **Features of "XVA-160αII 'Z'"** This ultra-high-resolution model achieves ultra-high magnification (2,000 times) and nanoscale sizes (250/800nm). It includes imaging examples such as transmission images and cross-sectional images of fingerprint sensors, as well as cross-sectional images of electromigration, and is equipped with numerous features including the U-Centric function, optical axis, rotation center, and automatic focus adjustment. *For more details, please refer to the PDF document or feel free to contact us.*

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  • X-ray inspection equipment

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X-ray CT system imaging example: CT cross-section of solder cracks

X-ray CT system imaging example: CT cross-section of solder cracks

We will introduce a case of tomographic imaging of solder cracks inside semiconductors captured with a micro-focus X-ray CT system!

The micro-focus X-ray CT system 'XVA-160RZ' is an X-ray CT system that can visualize high-resolution fine internal structures used in applications such as non-destructive testing and material analysis. You can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system 'XVA-160RZ'! It is a case where the internal solder crack of a semiconductor was imaged. 【Details】 ■ Industry of the company that introduced the system Semiconductor, electronic components, and electronic equipment manufacturing ■ Purpose of introduction Quality assurance, failure analysis ■ Effects of introduction Increased productivity due to improved success rate of failure analysis work Improved yield due to faster identification of defect causes *For more details, please check the PDF download.

  • X-ray inspection equipment

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【UHS_X-ray CT System Imaging Example】 CT Cross-section of Solder Crack

【UHS_X-ray CT System Imaging Example】 CT Cross-section of Solder Crack

This is a case where a solder crack was detected by performing CT imaging of an interposer substrate using the Micro Focus X-ray CT system XVA-160RZ.

The XVA-160RZ is a versatile 3D X-ray CT system that can be used for quality assurance, failure analysis, and inspection of semiconductors, electronic components, and electronic modules. By utilizing functions such as real-time observation, 3D oblique CT, and orthogonal CT according to the application, it not only advances analysis tasks efficiently but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.

  • X-ray inspection equipment

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【UHS_X-ray CT System Imaging Case】FET Observation Case

【UHS_X-ray CT System Imaging Case】FET Observation Case

This is a case where a FET was imaged using a micro-focus X-ray CT system XVA-160RZ, and voids were detected.

This is an example of capturing an FET (Field Effect Transistor) using 3D oblique CT. In fluoroscopy, it is difficult to distinguish the voids in each layer because the solder in the mounting area overlaps with the solder under the chip. By using CT imaging, it becomes possible to observe the sections separately, as shown in the attached materials. The XVA-160RZ allows for specifying the imaging area during the fluoroscopic observation phase through its user-centric function, enabling a transition to 3D oblique CT imaging without removing the sample, which also contributes to reducing labor costs.

  • X-ray inspection equipment

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[UHS_X-ray CT System Imaging Case] QFP_Wire

[UHS_X-ray CT System Imaging Case] QFP_Wire

This is a case where the wire bonding part inside a QFP was enlarged and imaged using orthogonal CT with the Micro Focus X-ray CT system XVA-160RZ.

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It allows for detailed observation of the second bonding marks of the wires. The XVA-160RZ enables easy orthogonal CT imaging simply by attaching a dedicated unit without the need to change the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

  • X-ray inspection equipment

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[UHS_X-ray CT System Imaging Example] CT Cross-Section of Smartphone-Mounted CPU

[UHS_X-ray CT System Imaging Example] CT Cross-Section of Smartphone-Mounted CPU

This is an example of a CT scan taken of a smartphone-mounted CPU.

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"! It is a case where CT scans of a smartphone-mounted CPU were taken.

  • X-ray inspection equipment

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[UHS_X-ray CT System Imaging Example] Smartphone Internal Circuit Board

[UHS_X-ray CT System Imaging Example] Smartphone Internal Circuit Board

This is an example of a CT scan of a smartphone's internal circuit board. It is possible to observe the patterns and structures of each internal layer.

The "XVA-160αII 'Z'" is a nano-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system is an ultra-high-resolution model that achieves ultra-high magnification (2000 times) and nano-order sizes (250/800nm). The patterns of each internal layer are captured clearly. The condition of the fillet and the mounting state are also uniquely visible through CT imaging.

  • X-ray inspection equipment

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3D X-ray CT system 'XVA-160RA/160αII "Z"'

3D X-ray CT system 'XVA-160RA/160αII "Z"'

Easily achieve high magnification observation with our unique technology "User-Centric Mechanism." We support the discovery and analysis of defects in implementation boards and semiconductor devices.

Our company offers a 3D X-ray CT system that employs our unique technology, the "U-Centric Mechanism," allowing for easy and efficient observation at high magnification. In diagonal CT imaging, bringing the target area closer to the X-ray focus enables high-magnification tomographic imaging. This allows for detailed observation and strongly supports the discovery and analysis of defects in printed circuit boards and semiconductor devices. 【Features】 ◎ 'XVA-160RA' ■ A newly revamped model based on the standard model, compatible with high-resolution generators ■ Equipped with a nano-focus X-ray generator (focus size 250/800nm) ■ Enables clear observation of details at a magnification of 1,600 times ■ Features visible light mapping and automatic focus adjustment functions ◎ 'XVA-160αII "Z"' ■ A high-end model specialized for even higher magnification, capable of analyzing the internal structure of packages ■ Equipped with a nano-focus X-ray generator (focus size from 200nm) ■ Allows precise observation of detailed structures at a magnification of 2,000 times ■ Features a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus

  • X-ray inspection equipment

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Germany Compact Micro Nano Industrial CT System diondo d1

Germany Compact Micro Nano Industrial CT System diondo d1

Ideal for analysis and measurement of small and medium sizes. The adoption of high-performance transmission X-ray sources achieves four times the resolution compared to conventional methods within the same measurement time.

The diondo d1 is a high-resolution micro-nano CT system specially designed for the analysis and measurement of small and medium-sized components. Compared to conventional systems, the d1 can achieve up to 4 times the resolution in the same measurement time by using a high-output transmission X-ray source, and it can reduce the measurement time to 1/4 while maintaining the same resolution. Its very high transmission output also enables the analysis of challenging material combinations in new energy vehicle applications, such as new energy batteries. ● Short time, high resolution ● Highest accuracy, maximum detection volume ● High-precision granite machine system ● Coordinate measurement technology ● Advanced scan modes

  • Radiation detector
  • X-ray inspection equipment
  • Contract Analysis

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Special Solution Industrial CT System Germany diondo d!

Special Solution Industrial CT System Germany diondo d!

X-ray and CT systems compatible with various applications.

With over 25 years of experience in the field of industrial computer tomography, diondo GmbH has established itself as a market leader in innovative special solutions and customer-specific testing systems. This affects not only the dimensions of inspection systems, radiation sources, and detectors but also special operating sequences and evaluation algorithms. Thanks to the increasing options for functional modules, even large and complex computer tomography systems can be implemented in a short time with manageable development effort.

  • Contract Analysis
  • Analytical Equipment and Devices
  • 3D measuring device

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X-ray fluoroscopy and CT system [Achieving high-contrast internal inspection!]

X-ray fluoroscopy and CT system [Achieving high-contrast internal inspection!]

High-contrast internal inspection achieved with X-ray fluoroscopy and CT system! Enhanced 3D imaging!

At Tesco Corporation, we optimize and deliver systems tailored to our customers' samples. We offer advanced 3D imaging, enabling high-contrast internal inspections. It is also possible to automate the measurement workflow using macros. With a wide range of products available, you can choose the output and functions according to your target samples and applications. 【Examples of Lineup】 ■ High-output X-ray fluoroscopy/CT systems ■ High-output micro-focus X-ray fluoroscopy/CT systems ■ Micro-focus X-ray fluoroscopy/CT systems ■ Ultra-high-output X-ray CT systems *For more details, please request our materials or view the PDF data available for download.

  • X-ray inspection equipment
  • Contract Inspection

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